Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
نویسندگان
چکیده
منابع مشابه
Design Guidance for the Mechanical Reliability of Low-K Flip Chip BGA Package
Flip Chip Ball Grid Array (FCBGA) package has been introduced in recent years to address the needs in the microelectronic packaging industry for increasing performance and I/O density, which offers a cost effective solution with smaller form factor. Furthermore, Cu interconnects with low-k dielectric material were also introduced to reduce power consumption and further enhance device performanc...
متن کاملDesign for Flip-Chip and Chip-Size Package Technology
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologies. This movement is occurring at all levels: at the IC, at the IC package, at the module, at the hybrid, the PC board which ties all the systems together. Interconnection density and methodology becomes ...
متن کامل50 GHz Broadband SMT Package for Microwave Applications
Due to the rapid growth in the use of Internet and mobile communications, the high speed transmission capacity requirements have been increasing at a high rate. As a result of this, the semiconductor and packaging technologies have seen significant advances. Especially, wireless communication systems in the microwave/millimeter wave bands, such as LMDS (Local Multipoint Distribution System), Po...
متن کاملDesign and Technology of Ultra Thin Chip Packages for High-Frequency Applications up to 60 GHz
متن کامل
Design and Fabrication of a 911 GHz Balanced Low Noise Amplifier Using HJFET
This paper describes the design of an X-band balanced low noise amplifier (LNA) using an available HJFET device. The balanced LNA consists of a pair of electrically similar transistors whose input and output signals are divided or combined by 3 dB two-stage Wilkinson power dividers. The proposed balanced LNA is fabricated and measured. The measured results show that the noise figure is 1.30 dB ...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: IEEE Transactions on Components, Packaging and Manufacturing Technology
سال: 2012
ISSN: 2156-3950,2156-3985
DOI: 10.1109/tcpmt.2011.2171485